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DATA SHEET
TDA6107JF Triple video output amplifier
Product specification 2002 Oct 18
Philips Semiconductors
Product specification
Triple video output amplifier
FEATURES * Typical bandwidth of 5.5 MHz for an output signal of 60 V (p-p) * High slew rate of 900 V/s * No external components required * Very simple application * Single supply voltage of 200 V * Internal reference voltage of 2.5 V * Fixed gain of 50 * Black-Current Stabilization (BCS) circuit with voltage window from 1.8 to 6 V and current window from -100 A to 10 mA * Thermal protection * Internal protection against positive flashover discharges appearing on the CRT. ORDERING INFORMATION TYPE NUMBER TDA6107JF PACKAGE NAME DBS9MPF DESCRIPTION plastic DIL-bent-SIL medium power package with fin; 9 leads GENERAL DESCRIPTION
TDA6107JF
The TDA6107JF includes three video output amplifiers and is intended to drive the three cathodes of a colour CRT directly. The device is contained in a plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package, and uses high-voltage DMOS technology. To obtain maximum performance, the amplifier should be used with black-current control.
VERSION SOT111-1
2002 Oct 18
2
Philips Semiconductors
Product specification
Triple video output amplifier
BLOCK DIAGRAM
handbook, full pagewidth
TDA6107JF
VDD 6 MIRROR 1 MIRROR 5
TDA6107JF
CASCODE 1
MIRROR 4 CURRENT SOURCE 1x THERMAL PROTECTION CIRCUIT Vi(1), Vi(2), Vi(3)
3x
1x 9, 8, 7 Voc(3), Voc(2), Voc(1)
Rf VIP REFERENCE DIFFERENTIAL STAGE
1, 2, 3 Ri Ra
MIRROR 3
5
Io(m)
3x
CASCODE 2
MIRROR 2 4
MBL525
Fig.1 Block diagram (one amplifier shown).
PINNING SYMBOL Vi(1) Vi(2) Vi(3) GND Iom VDD Voc(3) Voc(2) Voc(1) PIN 1 2 3 4 5 6 7 8 9 DESCRIPTION inverting input 1 inverting input 2 inverting input 3 ground (fin) black-current measurement output supply voltage cathode output 3 cathode output 2 cathode output 1
handbook, halfpage
Vi(1) Vi(2) Vi(3) GND Iom VDD Voc(3) Voc(2) Voc(1)
1 2 3 4 5 TDA6107JF 6 7 8 9
MBL524
Fig.2 Pin configuration.
2002 Oct 18
3
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages measured with respect to pin 4 (ground); currents as specified in Fig.1; unless otherwise specified. SYMBOL VDD Vi Vo(m) Voc Iocsm(L) Iocsm(H) Tstg Tj Ves supply voltage input voltage at pins 1 to 3 measurement output voltage cathode output voltage LOW non-repetitive peak cathode output current at a flashover discharge of 100 C HIGH non-repetitive peak cathode output current at a flashover discharge of 100 nC storage temperature junction temperature electrostatic handling voltage Human Body Model (HBM) Machine Model (MM) HANDLING Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling MOS devices (see "Handling MOS Devices"). QUALITY SPECIFICATION Quality specification "SNW-FQ-611 part D" is applicable and can be found in the "Quality reference Handbook". The handbook can be ordered using the code 9397 750 00192. - - 3000 300 V V PARAMETER 0 0 0 0 0 0 -55 -20 MIN. 12 6 VDD 3 6 +150 +150 MAX. 250 V V V V A A C C UNIT
2002 Oct 18
4
Philips Semiconductors
Product specification
Triple video output amplifier
THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Rth(j-fin) Rth(h-a) Note 1. An external heatsink is necessary. Thermal protection
MBH989
TDA6107JF
PARAMETER thermal resistance from junction to ambient thermal resistance from junction to fin thermal resistance from heatsink to ambient note 1
CONDITIONS
VALUE 56 11 18
UNIT K/W K/W K/W
handbook, halfpage
8
Ptot (W) 6
(1)
The internal thermal protection circuit gives a decrease of the slew rate at high temperatures: 10% decrease at 130 C and 30% decrease at 145 C (typical values on the spot of the thermal protection circuit).
4
(2)
handbook, halfpage
outputs 5 K/W thermal protection circuit
2
0 -40
6 K/W 0 40 80 120 160 Tamb (C) fin
MGK279
(1) Infinite heatsink. (2) No heatsink.
Fig.3 Power derating curves.
Fig.4 Equivalent thermal resistance network.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
CHARACTERISTICS Operating range: Tj = -20 to +150 C; VDD = 180 to 210 V. Test conditions: Tamb = 25 C; VDD = 200 V; Vo(c1) = Vo(c2) = Vo(c3) = 12VDD; CL = 10 pF (CL consists of parasitic and cathode capacitance); Rth(h-a) = 18 K/W (measured in test circuit of Fig.8); unless otherwise specified. SYMBOL Iq Vref(int) Ri G G VO(oc) VO(oc)(offset) PARAMETER quiescent supply current internal reference voltage (input stage) input resistance gain of amplifier gain difference nominal output voltage at pins 7, 8 and 9 (DC value) differential nominal output offset voltage between pins 7 and 8, 8 and 9 and 9 and 7 (DC value) output voltage temperature drift at pins 7, 8 and 9 Ii = 0 A Ii = 0 A CONDITIONS - - 47.5 -2.5 116 - MIN. 5.6 TYP. 6.6 2.5 3.6 51.0 0 129 0 - - 55.0 +2.5 142 5 V V MAX. 7.6 V k UNIT mA
Vo(c)(T)
- -
10 0
- -
mV/K mV/K
Vo(c)(T)(offset) differential output offset voltage temperature drift between pins 7 and 8, 8 and 9 and 7 and 9 Io(m)(offset) offset current of measurement Io(c) = 0 A; output (for three channels) 1.5 V < Vi < 5.5 V; 1.8 V < Vo(m) < 6 V linearity of current transfer (for three channels) -100 A < Io(c) < 100 A; 1.5 V < Vi < 5.5 V; 1.8 V < Vo(m) < 6 V -100 A Io(c) < 10 mA; 1.5 V < Vi < 5.5 V; 1.8 V < Vo(m) < 4 V Io(c)(max) Vo(c)(min) Vo(c)(max) BS BL tPco maximum peak output current 50 V < Vo(c) < VDD - 50 V (pins 7, 8 and 9) minimum output voltage (pins 7, 8 and 9) maximum output voltage (pins 7, 8 and 9) small signal bandwidth (pins 7, 8 and 9) large signal bandwidth (pins 7, 8 and 9) cathode output propagation time 50% input to 50% output (pins 7, 8 and 9) Vi = 7.0 V; at Io(c) = 0 mA; note 1 Vi = 1.0 V; at Io(c) = 0 mA; note 1 Vo(c) = 60 V (p-p) Vo(c) = 100 V (p-p) Vo(c) = 100 V (p-p) square wave; f <1 MHz; tr = tf = 40 ns (pins 1, 2 and 3); see Figs 6 and 7 6
-50
-
+50
A
Io(m)/Io(c)
-0.9
-1.0
-1.1
-0.9
-1.0
-1.1
- -
20 -
- 10 - - - -
mA V V MHz MHz ns
VDD - 15 - - - - 5.5 4.5 60
2002 Oct 18
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
SYMBOL tPco
PARAMETER difference in cathode output propagation time 50% input to 50% output (pins 7 and 8, 7 and 9 and 8 and 9) cathode output rise time 10% output to 90% output (pins 7, 8 and 9) cathode output fall time 90% output to 10% output (pins 7, 8 and 9) settling time 50% input to 99% < output < 101% (pins 7, 8 and 9)
CONDITIONS Vo(c) = 100 V (p-p) square wave; f < 1 MHz; tr = tf = 40 ns (pins 1, 2 and 3) Vo(c) = 50 to 150 V square wave; f < 1 MHz; tf = 40 ns (pins 1, 2 and 3); see Fig.6 Vo(c) = 150 to 50 V square wave; f < 1 MHz; tr = 40 ns (pins 1, 2 and 3); see Fig.7 Vo(c) = 100 V (p-p) square wave; f < 1 MHz; tr = tf = 40 ns (pins 1, 2 and 3); see Figs 6 and 7 Vi = 4 V (p-p) square wave; f < 1 MHz; tr = tf = 40 ns (pins 1, 2 and 3) Vo(c) = 100 V (p-p) square wave; f < 1 MHz; tr = tf = 40 ns (pins 1, 2 and 3); see Figs 6 and 7 f < 50 kHz; note 2
MIN. -10 0
TYP.
MAX. +10
UNIT ns
to(r)
67
91
113
ns
to(f)
67
91
113
ns
tst
-
-
350
ns
SR
slew rate between 50 V to (VDD - 50 V) (pins 7, 8 and 9) cathode output voltage overshoot (pins 7, 8 and 9)
-
900
-
V/s
Ov
-
2
-
%
PSRR ct(DC) Notes
power supply rejection ratio DC crosstalk between channels
- -
55 -50
- -
dB dB
1. See also Fig.5 for the typical DC-to-DC transfer of VI to VO(oc). 2. The ratio of the change in supply voltage to the change in input voltage when there is no change in output voltage.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
handbook, halfpage
200
MBH988
Vo(c) (V)
160
129
120
80
40
0 0 2
2.5
4
Vi (V)
6
Fig.5 Typical DC-to-DC transfer of VI to VOC.
2002 Oct 18
8
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
4.04 Vi (V)
3.08 t
2.12
tst Ov (in %) 150 140 Vo(c) (V) 100 149 151
60 50
t to(r) tPco
MGK280
Fig.6 Output voltage (pins 7, 8 and 9) rising edge as a function of the AC input signal.
2002 Oct 18
9
Philips Semiconductors
Product specification
Triple video output amplifier
TDA6107JF
4.04 Vi (V)
3.08 t
2.12
tst
150 140 Vo(c) (V) 100 Ov (in %) 60 50 49 t to(f) tPco
MGK281
51
Fig.7 Output voltage (pins 7, 8 and 9) falling edge as a function of the AC input signal.
2002 Oct 18
10
Philips Semiconductors
Product specification
Triple video output amplifier
Cathode output The cathode output is protected against peak current (caused by positive voltage peaks during high-resistance flash) of 3 A maximum with a charge content of 100 C (1). The cathode is also protected against peak currents (caused by positive voltage peaks during low-resistance flash) of 6 A maximum with a charge content of 100 nC (1). The DC voltage of VDD (pin 6) must be within the operating range of 180 to 210 V during the peak currents. Flashover protection The TDA6107JF incorporates protection diodes against CRT flashover discharges that clamp the cathodes output voltage up to a maximum of VDD + Vdiode. To limit the diode current an external 1.5 k carbon high-voltage resistor in series with the cathode output and a 2 kV spark gap are needed (for this resistor value, the CRT has to be connected to the main PCB (1). VDD must be decoupled to GND: 1. With a capacitor >20 nF with good HF behaviour (e.g. foil); this capacitor must be placed as close as possible to pins 6 and 4, but definitely within 5 mm. 2. With a capacitor >3.3 F on the picture tube base print, depending on the CRT size. Switch-off behaviour The switch-off behaviour of the TDA6107JF is controllable. This is because the output pins of the TDA6107JF are still under control of the input pins for low power supply voltages (approximately 30 V and higher). Bandwidth The addition of the flash resistor produces a decreased bandwidth and increases the rise and fall times; see "Application Note AN96072". (1)External protection against higher currents is described in "Application Note AN96072". Dissipation
TDA6107JF
Regarding dissipation, distinction must first be made between static dissipation (independent of frequency) and dynamic dissipation (proportional to frequency). The static dissipation of the TDA6107JF is due to voltage supply currents and load currents in the feedback network and CRT. The static dissipation Pstat equals: P stat = V DD x I DD + 3 x V OC x I OC Where: VDD = supply voltage IDD = supply current VOC = DC value of cathode voltage IOC = DC value of cathode current. The dynamic dissipation Pdyn equals: P dyn = 3 x V DD x ( C L + C int ) x f i x V oc(p-p) x Where: CL = load capacitance Cint = internal load capacitance (4 pF) fi = input frequency Voc(p-p) = output voltage (peak-to-peak value) = non-blanking duty cycle. The IC must be mounted on the picture tube base print to minimize the load capacitance CL.
2002 Oct 18
11
Philips Semiconductors
Product specification
Triple video output amplifier
TEST AND APPLICATION INFORMATION
TDA6107JF
handbook, full pagewidth
VDD C1 J1 1 Ri 1 Ra 22 nF Iom C9 3.2 pF J2 2 Ri 2 Ra 22 nF Iom C12 3.2 pF J3 3 Ri 3 Ra 22 nF Iom C15 3.2 pF VIP REFERENCE 5 C17 136 pF R6 100 k C14 136 pF R4 100 k C11 136 pF R2 100 k Rf Vof 6 C7 20 nF C8 10 F
Vi(1)
22 F C2
Voc(1)
9 C10 6.8 pF R1 2 M probe 1
C3 Vi(2) 22 F C4
Rf Vof Voc(2)
8 C13 6.8 pF R3 2 M probe 2
C5 Vi(3) 22 F C6
Rf Vof Voc(3)
7 C16 6.8 pF R5 2 M probe 3
TDA6107JF
4
Vo(m) 4V
MBL526
Current sources J1, J2 and J3 are to be tuned so that Vo(c) of pins 9, 8 and 7 is set to 100 V.
Fig.8 Test circuit.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
INTERNAL CIRCUITRY
TDA6107JF
handbook, full pagewidth
GND to cascode stage 4
VDD 6 to black current measurement circuit
1, 2, 3
TDA6107JF
(1)
esd
from input circuit esd to black current measurement circuit from control circuit from input circuit Vbias
esd esd
flash 7, 8, 9
5 esd 6.8 V
from black current measurement circuit from control circuit
esd
to black current measurement circuit
to black current measurement circuit
MBL527
(1) All pins have an energy protection for positive or negative overstress situations.
Fig.9 Internal pin configuration.
2002 Oct 18
13
Philips Semiconductors
Product specification
Triple video output amplifier
PACKAGE OUTLINE DBS9MPF: plastic DIL-bent-SIL medium power package with fin; 9 leads
TDA6107JF
SOT111-1
D
D1 q P P1 Q A2
A3 q1 q2
A A4 seating plane pin 1 index
E
L 1 Z b2 e b b1 wM 9
c
e2
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 A3 max. 3.7 8.7 8.0 A4 b b1 b2 c D (1) D1 E (1) e e2 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q q q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0
65o 55o
15.5 1.40 0.67 1.40 0.48 21.8 21.4 6.48 2.54 2.54 15.1 1.14 0.50 1.14 0.38 21.4 20.7 6.20
1.75 15.1 1.55 14.9
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT111-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-03-11
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
SOLDERING Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds.
TDA6107JF
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING DBS, DIP, HDIP, SDIP, SIL Note 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. suitable suitable(1) WAVE
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
TDA6107JF
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 Oct 18
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Philips Semiconductors
Product specification
Triple video output amplifier
NOTES
TDA6107JF
2002 Oct 18
17
Philips Semiconductors
Product specification
Triple video output amplifier
NOTES
TDA6107JF
2002 Oct 18
18
Philips Semiconductors
Product specification
Triple video output amplifier
NOTES
TDA6107JF
2002 Oct 18
19
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753504/02/pp20
Date of release: 2002
Oct 18
Document order number:
9397 750 10545

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